- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
Patent holdings for IPC class H01L 23/14
Total number of patents in this class: 1894
10-year publication summary
|
148
|
148
|
144
|
191
|
182
|
188
|
180
|
162
|
143
|
53
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
191 |
| Intel Corporation | 45621 |
86 |
| Samsung Electronics Co., Ltd. | 131630 |
58 |
| Murata Manufacturing Co., Ltd. | 22355 |
45 |
| Invensas Corporation | 645 |
34 |
| Infineon Technologies AG | 8189 |
29 |
| Mitsubishi Electric Corporation | 43934 |
29 |
| Mitsubishi Materials Corporation | 2378 |
29 |
| Rohm Co., Ltd. | 5843 |
27 |
| Semiconductor Components Industries, L.L.C. | 5345 |
27 |
| Applied Materials, Inc. | 16587 |
26 |
| Shinko Electric Industries Co., Ltd. | 1186 |
26 |
| Texas Instruments Incorporated | 19376 |
24 |
| Kyocera Corporation | 12735 |
24 |
| Qualcomm Incorporated | 76576 |
22 |
| Fuji Electric Co., Ltd. | 4750 |
22 |
| Siliconware Precision Industries Co., Ltd. | 489 |
22 |
| International Business Machines Corporation | 60644 |
21 |
| Advanced Semiconductor Engineering, Inc. | 1546 |
20 |
| Sumitomo Bakelite Co., Ltd. | 1416 |
20 |
| Other owners | 1112 |